Hauv cov haujlwm xws li lub zog tshiab thiab cov khoom siv hluav taws xob, graphite conductive daim hlau tau dav siv hauv cov khoom tseem ceeb xws li cov roj teeb modules thiab cov khoom siv hluav taws xob vim lawv cov conductivity zoo dua thiab cov cua sov dissipation. Txiav cov ntaub ntawv no xav tau cov qauv huab cua rau qhov tseeb (kom tsis txhob muaj kev puas tsuaj), ntug zoo (kom tsis txhob muaj cov khib nyiab cuam tshuam rau circuits), thiab cov txheej txheem yooj (kom hloov mus rau cov kev qhia tshwj xeeb).
Cov txheej txheem txiav ib txwm, uas vam khom cov pwm lossis cov cuab yeej siv zoo tib yam, feem ntau ua rau muaj qhov sib txawv me me, cov npoo ntxhib, thiab kev hloov pauv qeeb. Lub IECHO BK4 High-Speed Digital Cutting System yog tsim tshwj xeeb rau graphite conductive daim hlau, muab cov kev daws teeb meem zoo uas sib npaug ntau qhov kev xav tau nrog kev ua raws li kev cai.
I. Core Positioning: daws qhov “3 Cov Ntsiab Lus Mob "hauv Graphite Conductive Phaj Txiav
Graphite conductive daim hlau feem ntau yog 0.5 mus rau 5 hli tuab, nkig, thiab ua rau chipping. Cov kev cai txiav muaj xws li ± 0.1 hli precision, tawg-dawb npoo, thiab kev txhawb nqa rau cov txheej txheem nyuaj xws li qhov tsis sib xws lossis cov qhov. Traditional txoj kev ntsib meej shortcomings:
Tsis zoo Precision:Kev tuav txoj hauj lwm los yog cov cav tov pa yog qhov ua rau muaj qhov sib txawv ntawm qhov sib txawv. Txawm tias 0.2 hli misalignment ntawm splicing cov ntsiab lus yuav txo tau conductivity thiab pheej hmoo cov cuab yeej tsis ua hauj lwm.
Poor Edge Quality:Cov cuab yeej tsoos feem ntau ua rau delamination thiab ntxhib npoo. Cov khib nyiab pov tseg hauv cov khoom siv hluav taws xob tuaj yeem tsim kev pheej hmoo luv luv.
Slow Customization:Pwm-dependent txiav yuav tsum muaj pwm tshiab rau txhua qhov kev hloov pauv (qhov sib txawv, qhov sib txawv, thiab lwm yam), siv 3 mus rau 7 hnub, tsis haum rau cov khoom me me, ntau qhov kev xav tau hauv kev lag luam tshiab zog.
BK4 hais txog cov ntsiab lus mob ntawm lub hauv paus:
Pwm-dawb txiav→ ceev hloov pauv los ntawm tsuas yog import cov ntaub ntawv CAD.
Cov cuab yeej tshwj xeeb taub hau→ optimized rau graphite lub nkig zog, kom huv si ntug.
High-precision positioning system→ tswj qhov sib txawv ntawm qhov sib txawv hauv qhov tshwj xeeb, ua tau raws li qhov xav tau ntawm cov phaj ua tiav.
II. Core Technologies thiab Functions Tailored rau Graphite Conductive Phaj
1. Lub hom phiaj txiav kev ua haujlwm
BK4 txhawb nqa ob txoj haujlwm ua haujlwm:
Phau ntawv pub mis(optimized rau cov ntaub ntawv ntawv)
Xaiv tsis siv neeg pub mis(rau yob-raws li graphite substrates)
Cov txheej txheem pub mis(rau plates):
Material Positioning:Tus neeg teb xov tooj tso lub phaj; lub tshuab pib-calibrates nrog ± 0.05 hli raug, tshem tawm tib neeg yuam kev.
Kev teeb tsa Parameter:Qhov system xaiv cov cuab yeej tsim nyog (pneumatic riam / oscillating riam) thiab txiav tsis raws li tuab, ua kom huv si tsis muaj ntug chipping.
Ib-Click Txiav:Real-time saib xyuas cov cuab yeej siab thiab ceev thoob plaws hauv cov txheej txheem.
Rau yob-hom graphite substrates, ib qho pib pub noj khib tuaj yeem muab ntxiv kom ua tiav tag nrho automation: pub → tso → txiav → sau, zoo tagnrho rau ntau lawm.
2. Cov cuab yeej tshwj xeeb taub hau thiab cov txheej txheem
Pneumatic riam:Tsim los rau nruab nrab-rau-tuab graphite daim hlau. Uniform txiav tiv thaiv delamination thiab ntug chipping tshwm sim los ntawm oscillating kev co.
Punching cuab yeej:Rau kev teeb tsa lossis qhov txias txias (piv txwv, square, lossis tsis xwm yeem). Precision xuas nrig ntaus kom paub meej qhov tawg-dawb qhov npoo, ntsib nruj sib dhos tolerances.
V-Cut Tool:Enables precision slotting thiab beveling rau folding thiab splicing, nrog tswj qhov tob kom tsis txhob sib npaug ntawm phau ntawv grooving.
3. Cov qauv thiab cov txheej txheem rau kev ruaj ntseg mus ntev
Siab zogBua odyQauv:Cov khoom tseem ceeb (ntev, gantry, txiav cov cuab yeej, rooj) tau txais kev kub ntxhov siab, ua kom muaj kev ruaj ntseg hauv kev ua haujlwm siab thiab tsis txhob muaj kev cuam tshuam txog kev ua yuam kev.
Independently Developed Operating System:Nruab nrog IECHO tus tswv txiav software, txhawb nqa 3 lub luag haujlwm tseem ceeb:
a)Tsis siv neegNkev xavQhov system: Optimizes txiav layouts, boosting cov khoom siv.
b)Lub sijhawm tiag tiagData Mkev qhia:Qhia txiav ceev, cuab yeej siab, thiab cov khoom siv txoj hauj lwm.
c)Ib qho yooj yim Okev ua:Touchscreen interface nrog siab pom; cov neeg ua haujlwm tuaj yeem kawm hauv 1-2 teev, tsis muaj kev paub txog CNC.
III. Graphite Lub Hom Phiaj-UaTool
Lub IECHO BK4 tsis yog ib qho kev txiav tawm tab sis yog cov kev daws teeb meem tsim rau graphite conductive daim hlau. Los ntawm workflows optimized rau phaj txiav, rau cov cuab yeej tshwj xeeb lub taub hau kom ntseeg tau cov ntug zoo, rau cov qauv siv rau lub sij hawm ntev precision, txhua qhov feature yog tsim nyob ib ncig ntawm qhov tseeb, efficiency, thiab yooj.
Rau cov tuam txhab hauv cov khoom siv hluav taws xob tshiab thiab cov khoom siv hluav taws xob, BK4 tsis tsuas yog daws cov teeb meem tam sim ntawd ntawm kev ua tau zoo thiab kev ua haujlwm zoo, tab sis kuj, los ntawm cov pwm tsis muaj pwm thiab hloov tau yooj yim txiav peev xwm, txhawb kev hloov pauv yav tom ntej ntawm cov khoom me me, kev tsim khoom. Nws yog qhov kev sib tw tseem ceeb hauv kev txiav graphite.
Post lub sij hawm: Sep-19-2025