Umshini wokusika idayi we-laser we-LCT2
isici
isicelo
ipharamitha
| Uhlobo lomshini | I-LCT2 |
| Ukunemba kokusika nge-die | 0.1 mm |
| Ububanzi obukhulu bokusika | 350mm |
| Ububanzi obukhulu bezinto ezibonakalayo | 390mm |
| Ububanzi obukhulu bangaphandle | 700mm |
| Ifomethi yesithombe iyasekelwa | I-Al/BMP/PLT/DXF/DS/PDF |
| Usayizi wokubukeka (L×W×H) | 2032mm×1580mm×2006mm |
| Amandla e-laser | 300w |
| Ukusika | Okujwayelekile |
| Isishintshi sesithombe esiguquguqukayo se-QR | Ongakukhetha |
| I-Cold Lamination | Okujwayelekile |
| Ukusikwa Kweshidi | Ongakukhetha |
| Isihlanzi Somoya | Ongakukhetha |
uhlelo
Uhlelo lokususa intuthu ye-Convection
Ukusebenzisa ubuchwepheshe bomugqa ohlangothini oluvunguzayo oluvela phansi.
Ubuso bomsele wokususa intuthu buqediwe njengesibuko, kulula ukubuhlanza.
Uhlelo lwe-alamu yomusi oluhlakaniphile ukuvikela ngempumelelo izingxenye zokukhanya.
Uhlelo Lokulawula Ukucindezeleka Okuhlakaniphile
Indlela yokondla kanye nendlela yokwamukela isebenzisa isilawuli sebhuleki kanye nokucindezela kwe-magnetic powder, ukulungiswa kokucindezela kunembile, ukuqala kubushelelezi, futhi ukuma kuzinzile, okuqinisekisa ukuzinza nokunemba kokucindezeleka kwezinto ngesikhathi senqubo yokondla.
Uhlelo Lokulungisa Oluhlakaniphile lwe-Ultrasonic
Ukuqapha isimo sokusebenza ngesikhathi sangempela.
Izinga eliphezulu lokuphendula eliguquguqukayo kanye nokubekwa okunembile.
Idrayivu yemoto ye-servo ye-DC engenamabhulashi, idrayivu yesikulufu sebhola enembile.
Uhlelo Lokucubungula Nge-Laser
Inzwa ye-photoelectric ixhunywe ukuze kutholakale indawo ezenzakalelayo yedatha yokucubungula.
Uhlelo lokulawula lubala ngokuzenzakalelayo isikhathi sokusebenza ngokwedatha yokucubungula, futhi lulungisa isivinini sokudla ngesikhathi sangempela.
Isivinini sokusika esindizayo sifinyelela ku-5 m/s.
Uhlelo lwe-Photonic Integrated Circuit lwebhokisi le-laser
Yandisa impilo yengxenye ye-optical ngo-50%.
Isigaba sokuvikela i-IP44.